Development of a cure/postcure cycle for PETI-330 laminates fabricated by resin transfer molding

High Performance Polymers

Volumn 18, Issue 6, 2006, Pages 991-1001

  Bain, Stewart ^a   Ozawa, Hideki ^b   Criss, Jim M ^c  

^a SA Bain Consulting International Inc   (Canada)

^b UBE INDUSTRIES LTD   (Japan)

^c M and P Technologies Inc   (United States)

Author keywords

2,3,3 ,4 biphenyltetra carboxylic dianhydride; High temperature polymeric composites; Phenylethynyl terminated imides

Indexed keywords

CURING; DYNAMIC MECHANICAL ANALYSIS; ION EXCHANGE RESINS; OPTICAL MICROSCOPY; RESIN TRANSFER MOLDING; THERMOANALYSIS;

CARBON FABRIC; DYNAMIC MECHANICAL THERMAL ANALYSIS (DMTA); HIGH TEMPERATURE POLYMERIC COMPOSITES; ISOTHERMAL AGING; THERMAL POSTCURE TREATMENT; WEIGHT LOSS;

LAMINATES;

EID: 33845729899     PISSN: 09540083     EISSN: 13616412     Source Type: Journal    
DOI: 10.1177/0954008306069393     Document Type: Article

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