"Heat shield" - An enhancement device for an unshrouded, forced convection heat sink

Journal of Electronic Packaging

Volumn 128, Issue 2, 2006, Pages 172-176

  Prstic, Suzana ^a   Bar Cohen, Avram ^b  

^a INTEL CORPORATION   (United States)

^b UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHANNEL FLOW; COOLING SYSTEMS; HEAT SHIELDING; MICROPROCESSOR CHIPS; NUMERICAL METHODS; PRESSURE DROP;

HIGH POWER MICROPROCESSORS; SHROUDED HEAT SINKS; THERMAL ENHANCEMENT DEVICE; THERMAL MANAGEMENT;

HEAT SINKS;

EID: 33845706599     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.2188955     Document Type: Article

References (7)

1. Prstic, S., Iyengar, M., and Bar-Cohen, A., 2001, "Bypass Effect in High Performance Heat Sinks," J. Eng. Mech., 47, pp. 441-448.
2. Sparrow, E, M., Baliga, B. R., and Patankar, S. V., 1978, "Forced Convection Heat Transfer From a Shrouded Fin Array With and Without Tip Clearance," ASME J. Heat Transfer, 100, pp. 572-579.
3. Sparrow, E. M., and Kadle, D. S., 1986, "Effect of Tip to Shroud Clearance on Turbulent Heat Transfer From a Shrouded, Longitudinal Fin Array," ASME J. Heat Transfer, 108, pp. 519-524.
4. Butterbaugh, M. A., and Kang, S. S., 1995, "Effect of Airflow Bypass on the Performance of Heat Sinks in Electronic Cooling," ASME Proceedings of Advances in Electronic Packaging, Vol. 2, pp. 843-848.
5. FLUENT Inc., 1999, IcePak Reference Manual 3.0, http://www.fluent.com/ icepak.
6. Strei, D., 2000, "Wind Tunnel for the Testing of Heat Sinks," Plan B Paper, Department of Mechanical Engineering, University of Minnesota, Minneapolis, MN.
7. Nalional Instruments, 1998, Lab View 5.0, http://www.ni.com.