Study of the grain size, particle size and roughness of substrate in relation to the magnetic properties of electroplated permalloy

Journal of Alloys and Compounds

Volumn 428, Issue 1-2, 2007, Pages 230-236

  Yi, J B ^a   Li, X P ^a   Ding, J ^a   Seet, H L ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

Composite wire; Electroplating; Grain size; Particle size; Permalloy; Roughness

Indexed keywords

ELECTROPLATING; GRAIN SIZE AND SHAPE; MAGNETIC PROPERTIES; PARTICLE SIZE ANALYSIS; SPUTTERING; SUBSTRATES; SURFACE ROUGHNESS;

COMPOSITE WIRES; ELECTROPLATED PERMALLOYS; MATERIAL COERCIVITY; SURFACE SMOOTHNESS;

NICKEL ALLOYS;

EID: 33845701682     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2006.01.105     Document Type: Article

References (14)

1. Beach R.S., Smith N., Platt C.L., Jeffers F., and Berkowitz A.E. Appl. Phys. Lett. 68 (1996) 2753
2. Li X.P., Zhao Z.J., Oh T.B., Seet H.L., Neo B.H., and Koh S.J. Phys. Status Solidi (a) 201 8 (2004) 1992
3. Senda M., Ishii O., Koshimoto Y., and Toshima T. IEEE Trans. Magn. 30 (1994) 4611
4. Hika K., Panina L.V., and Mohri K. IEEE Trans. Magn. 32 (1996) 4594
5. Sinnecker J.P., Knobel M., Pirata K.R., Garcia J.M., Asenjo A., and Vázquez M. J. Appl. Phys. 87 (2000) 4825
6. Knobel M., and Pirota K.R. J. Magn. Magn. Mater. 242-245 (1999) 33
7. Ripka P. Sens. Actuators A 33 (1992) 129
8. Alben R., Becker J.J., and Chi M.C. J. Appl. Phys. 48 (1978) 1653
9. Herzer G. IEEE Trans. Magn. 26 5 (1990) 397
10. Seet H.L., See S.H., Li X.P., Lee J.Y., Lee K.Y.T., Teoh S.H., and Lim C.T. Mater. Sci. Forum 437/438 (2003) 79
11. Li X.P., Zhao Z.J., Ang S., Oh T.B., Song T.W., Ng W.C., Koh S.J., and Lee J.Y. Mater. Sci. Forum 437/438 (2003) 61
12. Atalay F.E., and Atalay S. J. Alloys Compd. 392 (2005) 322
13. Li X.P., Zhao Z.J., Chua C., Seet H.L., and Lu L. J. Appl. Phys. 94 (2003) 626
14. See S.H., Seet H.L., Li X.P., Lee J.Y., Lee K.Y.T., Teoh S.H., and Lim C.T. Mater. Sci. Forum 437/438 (2003) 53