Combined surface-focused acoustic microscopy in transmission and scanning ultrasonic holography

Ultrasonics

Volumn 44, Issue SUPPL., 2006, Pages

  Twerdowski, Evgeny ^a   von Buttlar, Moritz ^a   Razek, Nasser ^b   Wannemacher, Reinhold ^a   Schindler, Axel ^b   Grill, Wolfgang ^a  

^a UNIVERSITY OF LEIPZIG   (Germany)

^b LEIBNIZ INSTITUTE OF SURFACE ENGINEERING IOM   (Germany)

Author keywords

Acoustic holography; Acoustic microscopy; Directly bonded semiconductor wafers; Weak bond

Indexed keywords

ACOUSTIC HOLOGRAPHY; ACOUSTIC IMAGING; ACOUSTIC WAVE PROPAGATION; ANISOTROPY; CHEMICAL BONDS; NONDESTRUCTIVE EXAMINATION; ULTRASONICS;

DIRECTLY BONDED SEMICONDUCTOR WAFERS; SCANNING ULTRASONIC HOLOGRAPHY; TIME-OF-FLIGHT ANALYSIS;

ACOUSTIC MICROSCOPES;

ACOUSTIC MICROSCOPY; ARTICLE; CONFOCAL MICROSCOPY; EQUIPMENT; EQUIPMENT DESIGN; EVALUATION; HOLOGRAPHY; IMAGE ENHANCEMENT; INSTRUMENTATION; METHODOLOGY; REPRODUCIBILITY; SENSITIVITY AND SPECIFICITY; SYSTEM ANALYSIS;

EQUIPMENT DESIGN; EQUIPMENT FAILURE ANALYSIS; HOLOGRAPHY; IMAGE ENHANCEMENT; MICROSCOPY, ACOUSTIC; MICROSCOPY, CONFOCAL; REPRODUCIBILITY OF RESULTS; SENSITIVITY AND SPECIFICITY; SYSTEMS INTEGRATION;

EID: 33845698554     PISSN: 0041624X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ultras.2006.05.031     Document Type: Article

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