Comparing single-wafer and batch polymer cleans using inorganic chemicals in BEOL applications

MICRO

Volumn 24, Issue 4, 2006, Pages 45-49

  Couteau, Terri ^a   Dawson, Gary ^a   Halladay, John ^a   Archer, Leo ^a  

^a Spansion ^*

Author keywords

[No Author keywords available]

Indexed keywords

EID: 33845678506     PISSN: 10810595     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Review

References (6)

1. ES Meieran, "21st Century Semiconductor Manufacturing Capabilities," Intel Technical Journal 2, no. 4 (1998).
2. RA Gasser Jr., "Yield Learning and Volume Manufacturing of High Performance Logic Technologies on 200 mm and 300 mm Wafers," IEDM Technical Digest 28, no. 1 (2001): 1-4.
3. A Hand, "Wafer Cleaning Confronts Increasing Demands," Semiconductor International 24, no. 9 (2001): 62-66.
4. L Archer, S-A Henry, and D Nachreiner, "Removing Postash Polymer Residue from BEOL Structures Using Inorganic Chemicals," MICRO 19, no. 6 (2001): 95-103.
5. L Archer and T Couteau, "Real Fab Comparisons Reveal Advantage to Inorganic-Based Polymer Removal," Solid State Technology 45, no. 12 (2002): 43-46.
6. J-K Song et al., "Single-Wafer Polymer Removal on DRAM Structures Using Inorganic Chemicals," Solid State Technology 48, no. 5 (2005): 36-40.