Technological use histories for solder metals

IEEE International Symposium on Electronics and the Environment

Volumn 2006, Issue , 2006, Pages 201-205

  Graedel, T E ^a   Dong, J ^a   Jiansu, Mao ^a  

^a YALE UNIVERSITY   (United States)

Author keywords

Copper; Lead; Lead free; Metals; Solder; Tin

Indexed keywords

ELECTRONIC SOLDERS; NON LEADED SOLDERS; SOLDER METALS;

BISMUTH; LAWS AND LEGISLATION; LEAD ALLOYS; SOCIAL ASPECTS; TIN ALLOYS;

SOLDERING ALLOYS;

EID: 33845598252     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISEE.2006.1650061     Document Type: Conference Paper

References (6)

1. G. Joseph, Copper, Its Trade, Manufacture, Use, and Environmental Status, ASM International, Materials Park, OH, 1999.
2. O. Deubzer, O. H. Reichl, I. Cacho, R. Miguel, L. Irasarri, EFSOT (Next Generation Environment-Friendly Soldering Technology) - Recycling and Resource Consumption.
3. Kapur, A., The Future of the Red Metal: Scenario Analysis and Implications for Policy, Ph.D. Dissertation, Yale University, 2004, used by permission of Yale University.
4. Graedel, T.E., Materials substitution: A resource supply perspective, Resources, Conservation, and Recycling, 34, 107-115, 2002.
5. Errecart, J., and T.E. Graedel, A characterization of the year 2000 United States silver cycle, unpublished, 2002.
6. Graedel, T.E., and R.J. Klee, Elemental cycles: A status report on human or natural dominance, in preparation, 2003.