2-dimensional OVSF spread/chip-interleaved CDMA

IEICE Transactions on Communications

Volumn E89-B, Issue 12, 2006, Pages 3363-3375

  Liu, Le ^a   Adachi, Fumiyuki ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

2 dimensional OVSF spreading; CDMA; Chip interleaving; Multi rate; Uplink transmission

Indexed keywords

BIT ERROR RATE; CODES (SYMBOLS); COMPUTER SIMULATION; FREQUENCY DOMAIN ANALYSIS; MICROPROCESSOR CHIPS; SIGNAL INTERFERENCE;

CHIP INTERLEAVING; MULTIPLE ACCESS INTERFERENCE (MAI); ORTHOGONAL VARIABLE SPREADING FACTOR (OVSF); UPLINK TRANSMISSION;

CODE DIVISION MULTIPLE ACCESS;

EID: 33845597795     PISSN: 09168516     EISSN: 17451345     Source Type: Journal    
DOI: 10.1093/ietcom/e89-b.12.3363     Document Type: Article

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