Three dimensional optical interconnect on organic circuit board

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 789-794

  Matsubara, Takahiro ^a   Oda, Keiko ^a   Watanabe, Keiichiro ^a   Tanaka, Kaori ^a   Maetani, Maraki ^a   Nishimura, Yuriko ^a   Tanahashi, Shigeo ^a  

^a KYOCERA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC LINES; OPTICAL WAVEGUIDES; PASSIVE NETWORKS; PRINTED CIRCUIT BOARDS;

METAL LINES; OPTICAL SIGNAL TRANSMISSION; ORGANIC CIRCUIT BOARDS; PASSIVE ELECTRONIC DEVICES;

OPTICAL INTERCONNECTS;

EID: 33845589653     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645747     Document Type: Conference Paper

References (5)

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2. Z.Huang, Y.Ueno, K.Kaneko, N.M.Jokerst and S.Tanahashi, "Embedded Optical Interconnection using Thin Film InGaAs Metal-Semiconductor-Metal Photodetectors," IEE Electronics Letters, Vol.38, No.25, (2002), pp. 1708-1709.
3. E.N.Glytsis, N.M.Jokerst, R.A.Villalaz, S.Cho, S.Wu, Z.Huang, M.A.Brooke, and T.K.Gaylord, "Substrate-Embedded and Flip-Chip-Bonded Photodetector Polymer-Based Optical Interconnects: Analysis, Design, and Performance, " IEEE Journal of Lightwave Technology, Vol. 21, No. 10, (2003), pp. 2382-2394.
4. M.Immonen, M.Karppinen, and J.K.Kivilahti, "Fabrication and Characterization of Polymer Optical Waveguides With Integrated Micromirrors for Three-Dimensinal Board-Level Optical Interconnects," IEEE Transaction on Electronics Packaging Manufacturing, Vol.28, No.4, (2005),pp304-311.
5. see www.kyocera-slc.co.jp/english/products/cpcore.html