Demonstration of bidirectional optical link on optical PCB using a driver-receiver combined CMOS transceiver

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 1578-1582

  Kang, Sae Kyoung ^a   Lee, Tae Woo ^a   Hwang, Sung Hwan ^a   Cho, Mu Hee ^a   Park, Hyo Hoon ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BANDWIDTH; CHANNEL CAPACITY; CMOS INTEGRATED CIRCUITS; ELECTRIC CONNECTORS; MULTIMODE FIBERS; TRANSCEIVERS;

CHANNELS FIBERS; OPTICAL CONNECTOR; OPTICAL PCB (OPCB);

OPTICAL LINKS;

EID: 33845589640     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645867     Document Type: Conference Paper

References (13)

1. M. Forbes, J. Gourlay, M. Desmulliez, "Optically interconnected electronic chips: a tutorial and review of the technology," Electronics & Communication Engineering Journal, Vol. 13, No. 5 (2001), pp. 221-232.
2. I.-K. Cho, K. B. Yoon, S. H. Ahn, M. Y. Jeong, H.-K. Sung, B.-H. Lee, Y. U. Heo, H.-H. Park, "Board-to-board optical interconnection system using optical slots," IEEE Photon. Technol. Lett., Vol. 16, No. 7 (2004), pp. 1754-1756.
3. B. S. Rho, H. S. Cho, S. Kang, H.-H. Park, S.-W. Ha and B.-H. Rhee, "PCB-compatible optical interconnection using 45°-ended connection rods and via-holed waveguides," IEEE J. of Lightwave Technol., Vol. 22, No. 9 (2004), pp. 2128-2134.
4. M. H. Cho, S. H. Hwang, H. S. Cho, H.-H. Park, "High-coupling- efficiency optical interconnection using a 90°-bent fiber array connector in optical printed circuit boards," IEEE Photon. Technol. Lett., Vol. 17, No. 3 (2005), pp. 690-692.
5. F. Mederer, R. Jager, H. J. Unold, R. Michalzik, K. J. Ebeling, S. Lehmacher, A. Neyer, E. Griese, "3-Gb/s data transmission with GaAs VCSELs over PCB integrated polymer waveguides," IEEE Photon. Technol. Lett., Vol. 13, No. 9 (2001), pp. 1032-1034.
6. T. Nagahori, K. Miyoshi, Y. Aizawa, Y. Kusachi, Y. Nukada, N. Kami, N. Suzuki, "An analog front-end chip set employing an electro-optical mixed design on SPICE for 5-Gb/s/ch parallel optical interconnection," IEEE J. of Solid-State Circuits, Vol. 36, No. 12 (2001), pp. 1984-1991.
7. K. Kaminishl, H. Furuyama, K. Kojima, K. Hirakawa, "Si bipolar 3.3 V transmitter/receiver IC chip set for 1 Gb/s 12-channel parallel optical interconnects," in Dig. IEEE Int. Solid-State Circuits Conf., Feb. 1999, pp. 376-377.
8. S.-K. Kang, T.-W. Lee, D. V. Plant, and H.-H. Park, "A novel bidirectional CMOS transceiver for chip-to-chip optical interconnects," IEEE Photon. Technol. Lett., Vol. 18, No. 1 (2006), pp. 70-72.
9. S. H. Hwang, M. H. Cho, S.-K. Kang, H.-H. Park, H. S. Cho, S.-H. Kim, K.-U. Shin, and S.-W. Ha, "Passively assembled optical interconnection system based on an optical printed circuit board," IEEE Photon. Technol. Lett., to be published.
10. K. B. Yoon, I.-K. Cho, S. H. Ahn, M. Y. Jeong, D. J. Lee, Y. U. Heo, B. S. Rho, H.-H. Park, and B.-H. Rhee, "Optical backplane system using waveguide-embedded PCBs and metal optical slots", IEEE J. of Lightwave Technol., Vol. 22, No. 9 (2004),pp. 2119-2127.
11. H. S. Cho, S. Kang, B. S. Rho, H.-H. Park, K.-U. Shin, S.-W. Ha, and B.-H. Rhee, D.-S. Kim, S. T. Jung, T. Kim, "Fabrication of fiber-embedded boards using grooving technique for optical interconnection application," SPIE Optical Engineering, Vol. 43, No. 12 (2004), pp. 3083-3088.
12. B. S. Rho, M. H. Cho, H. S. Cho, S. Kang, H.-H. Park, S.-W. Ha and B.-H. Rhee, "Low-crosstalk and high-efficiency optical interconnection using 45°-ended connection rods in waveguide-embedded boards," Electron. Lett., Vol. 40, No. 12 (2004), pp. 730-732.
13. S.-P. Han, J. T. Kim, S.-W. Jung, S.-H. Ahn, C.-G. Choi, and M.-Y. Jeong, "A reflective curved mirror with low coupling loss for optical interconnection," IEEE Photon. Technol. Lett., Vol. 16, No. 1 (2004), pp. 185-187.