Design, fabrication and test of silicon heat pipes with radial microcapillary grooves

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2006, Issue , 2006, Pages 545-551

  Ivanova, M ^a   Lai, A ^a   Gillot, C ^a   Sillon, N ^a   Schaeffer, C ^b   Lefevre F ^c   Lallemand, M ^c   Fournier, E ^d  

^a CEA GRENOBLE   (France)

^b ENSIEG   (France)

^c CNRS   (France)

^d CNES   (France)

Author keywords

Heat pipe; Miniature; Radial structure; Silicon; Spreading

Indexed keywords

ELECTRONIC EQUIPMENT MANUFACTURE; ETCHING; HEAT TRANSFER; MINIATURE INSTRUMENTS; SILICON; TWO PHASE FLOW;

POWER DENSITIES; RADIAL STRUCTURE; SPREADING; THERMAL PERFORMANCE;

HEAT PIPES;

EID: 33845582474     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2006.1645392     Document Type: Conference Paper

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