메뉴 건너뛰기




Volumn 2006, Issue , 2006, Pages 1668-1676

Electrical-optical high speed serial server scalability link

Author keywords

[No Author keywords available]

Indexed keywords

DIGITAL COMMUNICATION LINKS; INPUT/OUTPUT (I/O) SUBSYSTEMS; SCALABILITY LINKS; SYMMETRIC MULTI PROCESSOR (SMP);

EID: 33845576088     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645882     Document Type: Conference Paper
Times cited : (3)

References (15)
  • 1
    • 0030688406 scopus 로고    scopus 로고
    • Extending the useful range of copper interconnects for high data rate signal transmission
    • May
    • J. Broomall, H. Van Deusen, "Extending the Useful Range of Copper Interconnects for High Data Rate Signal Transmission," 1997 Electronic Components and Technology Conference, pp. 196-203, May 1997.
    • (1997) 1997 Electronic Components and Technology Conference , pp. 196-203
    • Broomall, J.1    Van Deusen, H.2
  • 2
    • 0035519086 scopus 로고    scopus 로고
    • Frequency-dependent losses on high-performance interconnections
    • Nov.
    • Deutsch, A. et al. "Frequency-dependent losses on high-performance interconnections," Electromagnetic Compatibility, IEEE Transactions on, Volume: 43, Issue: 4, Nov. 2001 pp. 446-465.
    • (2001) Electromagnetic Compatibility, IEEE Transactions on , vol.43 , Issue.4 , pp. 446-465
    • Deutsch, A.1
  • 6
    • 33845576088 scopus 로고    scopus 로고
    • Electrical-optical high speed serial server scalability link
    • to be presented at
    • Kuchta, D. et al. "Electrical-Optical High Speed Serial Server Scalability Link", to be presented at ECTC 2006.
    • ECTC 2006
    • Kuchta, D.1
  • 9
    • 33845590306 scopus 로고    scopus 로고
    • Blades have the edge [blade servers]
    • April
    • Wright, J; "Blades have the edge [blade servers]", Spectrum, Volume 42, issue 4, April 2005. Page(s):24 - 29.
    • (2005) Spectrum , vol.42 , Issue.4 , pp. 24-29
    • Wright, J.1
  • 11
    • 0020812712 scopus 로고
    • A DC-balanced, partitioned-block, 8B/10B transmission code
    • A. X. Widmer and P. A. Franaszek, "A DC-Balanced, Partitioned-Block, 8B/10B Transmission Code," IBMJ. Res. Develop. 27, 1983, pp. 440-451.
    • (1983) IBMJ. Res. Develop. , vol.27 , pp. 440-451
    • Widmer, A.X.1    Franaszek, P.A.2
  • 12
    • 0032626881 scopus 로고    scopus 로고
    • Complex permittivity determination from propagation constant measurements
    • M. Janezic and J. Jargon, "Complex Permittivity Determination from Propagation Constant Measurements", IEEE Microwave and Guided Wave Letters, v. 9, n. 2. pp. 76-78, 1999.
    • (1999) IEEE Microwave and Guided Wave Letters , vol.9 , Issue.2 , pp. 76-78
    • Janezic, M.1    Jargon, J.2
  • 13
    • 34047239114 scopus 로고    scopus 로고
    • The recessed probe launch - A new signal launch for high frequency characterization of board level packaging
    • Santa Clara, CA, Jan
    • Kwark, Y et al, "The Recessed Probe Launch - A New Signal Launch for High Frequency Characterization of Board Level Packaging", DesignCon 2005, Santa Clara, CA, Jan 2005
    • (2005) DesignCon 2005
    • Kwark, Y.1
  • 14
    • 13944268275 scopus 로고    scopus 로고
    • Extraction of Er(f) and tand(f) for printed circuit board insulators Up to 30 GHz using the short-pulse propagation technique
    • [see also Components, Packaging and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on], Feb.
    • Deutsch, A. et al. "Extraction of Er(f) and tand(f) for Printed Circuit Board Insulators Up to 30 GHz Using the Short-Pulse Propagation Technique," Advanced Packaging, IEEE Transactions on [see also Components, Packaging and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on], Volume: 28, Issue: 1, Feb. 2005 pp. 4 -12.
    • (2005) Advanced Packaging, IEEE Transactions on , vol.28 , Issue.1 , pp. 4-12
    • Deutsch, A.1
  • 15
    • 0026971127 scopus 로고
    • Short-pulse propagation technique for characterizing resistive package interconnections
    • Deutsch, A. et al. "Short-pulse propagation technique for characterizing resistive package interconnections," IEEE Trans. Comp., Hybrids, Manufact. Technol., vol. 15, pp. 1034-1037, 1992.
    • (1992) IEEE Trans. Comp., Hybrids, Manufact. Technol. , vol.15 , pp. 1034-1037
    • Deutsch, A.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.