-
1
-
-
0030688406
-
Extending the useful range of copper interconnects for high data rate signal transmission
-
May
-
J. Broomall, H. Van Deusen, "Extending the Useful Range of Copper Interconnects for High Data Rate Signal Transmission," 1997 Electronic Components and Technology Conference, pp. 196-203, May 1997.
-
(1997)
1997 Electronic Components and Technology Conference
, pp. 196-203
-
-
Broomall, J.1
Van Deusen, H.2
-
2
-
-
0035519086
-
Frequency-dependent losses on high-performance interconnections
-
Nov.
-
Deutsch, A. et al. "Frequency-dependent losses on high-performance interconnections," Electromagnetic Compatibility, IEEE Transactions on, Volume: 43, Issue: 4, Nov. 2001 pp. 446-465.
-
(2001)
Electromagnetic Compatibility, IEEE Transactions on
, vol.43
, Issue.4
, pp. 446-465
-
-
Deutsch, A.1
-
3
-
-
84861252238
-
Enterprise X-architecture technology overview
-
Brown, J.D. and Dhawan, S., "Enterprise X-Architecture Technology Overview," IBM Enterprise X-Architecture Technology - Reaching the Summit, First Edition 2002, pp. 1-7. http://www-307.ibm.com/pc/support/site.wss/MIGR- 43307.html
-
IBM Enterprise X-Architecture Technology - Reaching the Summit, First Edition 2002
, pp. 1-7
-
-
Brown, J.D.1
Dhawan, S.2
-
6
-
-
33845576088
-
Electrical-optical high speed serial server scalability link
-
to be presented at
-
Kuchta, D. et al. "Electrical-Optical High Speed Serial Server Scalability Link", to be presented at ECTC 2006.
-
ECTC 2006
-
-
Kuchta, D.1
-
7
-
-
33845877960
-
Data center server packaging technology
-
Patel, P.; Hughes, J.; Herman, B.; Cases, M.; de Araujo, D.N.; Pham, N.; "Data Center Server Packaging Technology", IEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging,2004. Page(s):11-14.
-
(2004)
IEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging
, pp. 11-14
-
-
Patel, P.1
Hughes, J.2
Herman, B.3
Cases, M.4
De Araujo, D.N.5
Pham, N.6
-
8
-
-
15944362264
-
IBM BladeCenter system electrical packaging design challenges
-
Patel, P.; Hughes, J.; Herman, B.; Cases, M.; de Araujo, D.N.; Pham, N.; "IBM BladeCenter system electrical packaging design challenges", IEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging, 2004. Page(s):11-14.
-
(2004)
IEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging
, pp. 11-14
-
-
Patel, P.1
Hughes, J.2
Herman, B.3
Cases, M.4
De Araujo, D.N.5
Pham, N.6
-
9
-
-
33845590306
-
Blades have the edge [blade servers]
-
April
-
Wright, J; "Blades have the edge [blade servers]", Spectrum, Volume 42, issue 4, April 2005. Page(s):24 - 29.
-
(2005)
Spectrum
, vol.42
, Issue.4
, pp. 24-29
-
-
Wright, J.1
-
10
-
-
13944271869
-
T-Rex, a blade packaging architecture for mainframe servers
-
Feb
-
Katopis, G.A.; Becker, W.D.; Harrer, H.H.; "T-Rex, a blade packaging architecture for mainframe servers", Ad Advanced Packaging, IEEE Transactions on volume 28, isuue 1, Feb 2005 page(s):24-31
-
(2005)
Ad Advanced Packaging, IEEE Transactions on
, vol.28
, Issue.1
, pp. 24-31
-
-
Katopis, G.A.1
Becker, W.D.2
Harrer, H.H.3
-
11
-
-
0020812712
-
A DC-balanced, partitioned-block, 8B/10B transmission code
-
A. X. Widmer and P. A. Franaszek, "A DC-Balanced, Partitioned-Block, 8B/10B Transmission Code," IBMJ. Res. Develop. 27, 1983, pp. 440-451.
-
(1983)
IBMJ. Res. Develop.
, vol.27
, pp. 440-451
-
-
Widmer, A.X.1
Franaszek, P.A.2
-
12
-
-
0032626881
-
Complex permittivity determination from propagation constant measurements
-
M. Janezic and J. Jargon, "Complex Permittivity Determination from Propagation Constant Measurements", IEEE Microwave and Guided Wave Letters, v. 9, n. 2. pp. 76-78, 1999.
-
(1999)
IEEE Microwave and Guided Wave Letters
, vol.9
, Issue.2
, pp. 76-78
-
-
Janezic, M.1
Jargon, J.2
-
13
-
-
34047239114
-
The recessed probe launch - A new signal launch for high frequency characterization of board level packaging
-
Santa Clara, CA, Jan
-
Kwark, Y et al, "The Recessed Probe Launch - A New Signal Launch for High Frequency Characterization of Board Level Packaging", DesignCon 2005, Santa Clara, CA, Jan 2005
-
(2005)
DesignCon 2005
-
-
Kwark, Y.1
-
14
-
-
13944268275
-
Extraction of Er(f) and tand(f) for printed circuit board insulators Up to 30 GHz using the short-pulse propagation technique
-
[see also Components, Packaging and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on], Feb.
-
Deutsch, A. et al. "Extraction of Er(f) and tand(f) for Printed Circuit Board Insulators Up to 30 GHz Using the Short-Pulse Propagation Technique," Advanced Packaging, IEEE Transactions on [see also Components, Packaging and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on], Volume: 28, Issue: 1, Feb. 2005 pp. 4 -12.
-
(2005)
Advanced Packaging, IEEE Transactions on
, vol.28
, Issue.1
, pp. 4-12
-
-
Deutsch, A.1
-
15
-
-
0026971127
-
Short-pulse propagation technique for characterizing resistive package interconnections
-
Deutsch, A. et al. "Short-pulse propagation technique for characterizing resistive package interconnections," IEEE Trans. Comp., Hybrids, Manufact. Technol., vol. 15, pp. 1034-1037, 1992.
-
(1992)
IEEE Trans. Comp., Hybrids, Manufact. Technol.
, vol.15
, pp. 1034-1037
-
-
Deutsch, A.1
|