Electrical / optical high speed scalability link implementation

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn 2005, Issue , 2005, Pages 15-18

  Kuchta, D ^a   Baks, C ^a   Kwark, Y ^a   Mintarno, E ^a   De Araujo, D N ^b   Cases, M ^b   Matoglu, E ^b   Pham, N ^b  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DATA RATES; INTERNAL CLOCK FREQUENCIES; SKIN EFFECTS; SYMMETRIC MULTI PROCESSORS (SMP);

BANDWIDTH; COMPUTER NETWORKS; DIELECTRIC LOSSES; DIGITAL COMMUNICATION SYSTEMS; NATURAL FREQUENCIES; VELOCITY MEASUREMENT;

TELECOMMUNICATION LINKS;

EID: 33845573346     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2005.1563688     Document Type: Conference Paper

References (5)

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2. J. Broomall, H. Van Deusen, "Extending the Useful Range of Copper Interconnects for High Data Rate Signal Transmission," 1997 Electronic Components and Technology Conference, pp. 196-203, May 1997.
3. W. Ng, P. Galloway, M. Annand, "Copper Cabling for Multi-Gigabit Serial Links for Inter-Cabinet Connections," DesignCon 2002.
4. "Intel Processor-based servers: IBM x460. http://www-l.ibm.com/ servers/eserver/xseries/x460.html.
5. M. Janezic and J. Jargon, "Complex Permittivity Detennination from Propagation Constant Measurements", IEEE Microwave and Guided Wave Letters, v.9, n. 2. pp. 76-78, 1999.