Adhesion of metal/polymer bonds using PBT, PC, PS and copper

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 959-963

  Paproth, A ^a   Wolter, K J ^a   Deltschew, R ^b  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

^b Plasma and Surface Engineering IB   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; BONDING; ELECTRONICS PACKAGING; PLASMA APPLICATIONS; POLYCARBONATES; SUBSTRATES;

PLASMA TREATMENT; POLAR GROUPS; POLYBUTYLENE TEREPHTHALATE (PBT); POLYMERS STAND;

POLYSTYRENES;

EID: 33845569915     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645770     Document Type: Conference Paper

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