Modeling of 3-D vertical interconnect using support vector machine regression

IEEE Microwave and Wireless Components Letters

Volumn 16, Issue 12, 2006, Pages 639-641

  Xia, Lei ^a   Meng, Jicheng ^a   Xu, Ruimin ^a   Yan, Bo ^a   Guo, Yunchuan ^a  

^a UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINA   (China)

Author keywords

Fuzz button; Low temperature co fired ceramic (LTCC); Support vector machine (SVM); Support vector regression (SVR); Three dimensional (3 D) vertical interconnect

Indexed keywords

COMPUTER SIMULATION; MATHEMATICAL MODELS; MICROWAVE DEVICES; REGRESSION ANALYSIS; RISK MANAGEMENT;

FUZZ BUTTON; LOW TEMPERATURE CO-FIRED CERAMIC (LTCC); SUPPORT VECTOR MACHINE (SVM); SUPPORT VECTOR REGRESSION (SVR); THREE DIMENSIONAL (3-D) VERTICAL INTERCONNECT;

ELECTRONICS PACKAGING;

EID: 33845526395     PISSN: 15311309     EISSN: None     Source Type: Journal    
DOI: 10.1109/LMWC.2006.885585     Document Type: Article

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