Performance evaluation of a wavy-fin heat sink for power electronics

Applied Thermal Engineering

Volumn 27, Issue 5-6, 2007, Pages 969-975

  Lorenzini, Marco ^a   Fabbri, Giampietro ^b   Salvigni, Sandro ^b  

^a Dipartimento di Ingegneria Energetica   (Italy)

^b DIENCA   (Italy)

Author keywords

Electronics cooling; Heat sink; Thermal resistance; Wavy fin

Indexed keywords

ENERGY DISSIPATION; FINS (HEAT EXCHANGE); HEAT CONVECTION; HEAT FLUX; HEAT RESISTANCE; HEAT SINKS; VELOCITY MEASUREMENT;

ELECTRONIC COMPONENTS; ELECTRONICS COOLING; VELOCITY DISTRIBUTION; WAVY FINS;

POWER ELECTRONICS;

EID: 33845488719     PISSN: 13594311     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.applthermaleng.2006.08.006     Document Type: Article

References (10)

1. Kraus A.D., Aziz A., and Welty J. Extended Surface Heat Transfer (2000), Wiley-Interscience
2. Bar-Cohen A., and Kraus A.D. Advances in Thermal Modelling of Electronic Components and Systems vol. 2 (1990), ASME Press Series, New York pp. 41-107
3. G. Cesini, R. Ricci, B. Ruggeri, Ottimizzazione di dissipatori di calore alettati per applicazioni elettroniche. Modello numerico e verifica sperimentale, Atti X Congresso Nazionale UIT, 1992, pp. 201-212.
4. Leung C.W., and Probert S.D. Steady-state heat transfer from vertical fins protruding upwards from horizontal bases. Int. J. Energy 62 (1989) 94-101
5. Snider A.D., and Kraus A.D. The quest for the optimum longitudinal fin profile. Heat Transfer Eng. 8 2 (1987)
6. Tsukamoto Y., and Seguchi Y. Shape optimization problem for minimum volume fin. Heat Transfer Jpn. Res. 13 (1984) 1-19
7. A.D. Snider, A.D. Kraus, S. Graff, M. Rodriguez, A.G. Kusmierczyk, Optimal fin profiles, Classical and modern, in: Proc. 9th Int. Heat transfer Conf., vol. 4, Jerusalem (1990), pp. 15-19.
8. M. Spiga, G. Fabbri, Efficienza di dissipatori a profilo sinusoidale, Atti XII Congresso Nazionale UIT, (1994), pp. 197-204.
9. G. Fabbri, G. Lorenzini, Analisi numerica bidimensionale di dissipatori a profilo sinusoidale, Atti XIII Congresso Nazionale UIT, (1995), pp. 491-499.
10. G. Fabbri, M. Lorenzini, S. Salvigni, An innovative design of heat sinks for microelectronics, in: Proc. 4th European Thermal Sciences Conference, Birmingham, 2004.