Influence of process conditions of thixomolding® on the microstructure of magnesium mobile phone housing

Materials Science Forum

Volumn 488-489, Issue , 2005, Pages 377-380

  Cui, Xiaopeng ^a,b   Liu, Yongbing ^b   Cao, Zhanyi ^b   Yang, Xiaohong ^b   Liang, Wei ^b  

^a Changchun Huayu Magnesium Industry Co Ltd   (China)

^b JILIN UNIVERSITY   (China)

Author keywords

Microstructure; Process conditions; Thixomolding

Indexed keywords

ELECTRONIC EQUIPMENT; MICROSTRUCTURE; MOBILE PHONES;

BARREL TEMPERATURE; ELECTRONIC COMPONENTS; PROCESS CONDITIONS; SCREW ROTATE RATE;

METAL MOLDING;

EID: 33845274602     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/0-87849-968-7.377     Document Type: Conference Paper

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