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Volumn 154, Issue 1, 2007, Pages

A method for measuring frictional forces and shaft vibrations during chemical mechanical polishing

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; IN SITU PROCESSING; SHAFTS (MACHINE COMPONENTS); SILICA; VIBRATIONS (MECHANICAL);

EID: 33845239182     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2386929     Document Type: Article
Times cited : (9)

References (23)
  • 8
    • 33845245683 scopus 로고    scopus 로고
    • Y. A.Arimoto, R. L.Opila, C.Reidsema Simpson, K. B.Sundaram, I.Ali, and Y.Homma, Editors
    • W.-T. Tseng, R. Lu, P.-L. Kuo, C. L. Liao, and J.-F. Lin, in Chemical Mechanical Polishing in IC Device Manufacturing III, Y. A. Arimoto, R. L. Opila, C. Reidsema Simpson, K. B. Sundaram, I. Ali, and, Y. Homma, Editors, PV 99-37, p. 280, The Electrochemical Society Proceedings Series, Pennington, NJ (1999).
    • (1999) Chemical Mechanical Polishing in IC Device Manufacturing III , vol.PV 99-37 , pp. 280
    • Tseng, W.-T.1    Lu, R.2    Kuo, P.-L.3    Liao, C.L.4    Lin, J.-F.5


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.