Simulation of filling of microfluidic devices using a coarse-grained continuum contact angle model

2006 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2006 Technical Proceedings

Volumn 2, Issue , 2006, Pages 493-496

  Naraynan, C ^a   Lakehal, D ^a  

^a ASCOMP GMBH   (Switzerland)

Author keywords

Contact angle; Level set; Multiphase

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; CONTACT ANGLE; VELOCITY MEASUREMENT;

CONTACT LINE VELOCITY; DYNAMIC CONTACT ANGLE MODELS; MICRODEVICES; MULTIPHASE FLUID DYNAMICS;

FLUIDIC DEVICES;

EID: 33845223576     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

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5. Friess H.M. and Lakehal D., A new method for including interfacial tension and wetting dynamics in the simulation of two-phase flow, Comp. Heat Transfer 4 (CHT04), Kirkenes, Norway, 19-24, April (2004)
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