FEA simulation of thin film coils to power wireless neural interfaces

2006 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2006 Technical Proceedings

Volumn 1, Issue , 2006, Pages 705-708

  Kim, S ^a   Scholz, O ^b   Zoschke, K ^c   Harrison, R ^a   Solzbacher, F ^a   Klein, M ^c   Toepper, M ^c  

^a University of Utah   (United States)

^b FRAUNHOFER INSTITUTE FOR BIOMEDICAL ENGINEERING   (Germany)

^c FRAUNHOFER IZM   (Germany)

Author keywords

Finite element analysis (FEA); Microcoil; Neural interface

Indexed keywords

COMPUTER SIMULATION; ELECTRIC COILS; FINITE ELEMENT METHOD; INDUCTANCE; MAGNETIC COUPLINGS; MATHEMATICAL MODELS; MICROMACHINING; POWER TRANSMISSION; THIN FILMS;

BIOMEDICAL DEVICES; MICROCOILS; NEURAL INTERFACES; PARASITIC CAPACITANCES;

NEURAL NETWORKS;

EID: 33845222781     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. F. Solzbacher, R. Harrison. R.A. Normann, L. Rieth, S. Chakravarty, J.-M. Hsu, M. Klein, H. Oppermann, M. Toepper, and R. Hahn, "A next generation chronically implantable wireless neural interface," NIH/NINDS Annual Neural Interfaces Workshop, Bethesda, MD, 2005.
2. S. Kim, K. Buschick, K. Zoschke, M. Klein, M. Toepper, D. Black, R. Harrison, P. Tathireddy, F. Solzbacher, "Polymer based thin film coils as a power module of wireless neural interfaces," submitted to IEEE Workshop on Microelectronics and Electron Devices, Boise, ID, April 14, 2006.
3. S. Kim, O. Scholz, "FEA-characterization and optimization of planar microcoils used in implantable telemetry systems," submitted to IEEE Transactions on Biomedical Engineering.