Temperature distributions of SMA wires embedded in epoxy resin plates and heated by supplying electric current

Journal of Intelligent Material Systems and Structures

Volumn 17, Issue 12, 2006, Pages 1115-1120

  Umezaki, Eisaku ^a  

^a NIPPON INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

Epoxy resin plate; FEM; Shape memory alloy; Smart structure; Thermography

Indexed keywords

CRACK PROPAGATION; ELECTRIC CURRENTS; EPOXY RESINS; FINITE ELEMENT METHOD; HEAT TREATMENT; INTELLIGENT STRUCTURES; TEMPERATURE DISTRIBUTION; THERMOGRAPHY (IMAGING); WIRE;

CRACK PREVENTION; EPOXY RESIN PLATES; PLATE THICKNESS;

SHAPE MEMORY EFFECT;

EID: 33751574261     PISSN: 1045389X     EISSN: 15308138     Source Type: Journal    
DOI: 10.1177/1045389X06065234     Document Type: Article

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