Electromigration in Al interconnects and the challenges in ultra-deep submicron technology

Wuli Xuebao/Acta Physica Sinica

Volumn 55, Issue 10, 2006, Pages 5424-5434

  Zhang, Wen Jie ^a,b,c   Yi, Wan Bing ^a,b,c   Wu, Jin ^c  

^a SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY   (China)

^b UNIVERSITY OF CHINESE ACADEMY OF SCIENCES   (China)

^c SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION   (China)

Author keywords

Al interconnects; Electromigration; Microstructure

Indexed keywords

EID: 33751559216     PISSN: 10003290     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (67)