Influence of individual thermal shock parameters on stress generated in silicon nitride and its prediction

Journal of the European Ceramic Society

Volumn 27, Issue 4, 2007, Pages 2103-2110

  Gondar, Ernest ^a   Rosko, Miroslav ^a   Somorcik, Jan ^b  

^a SLOVAK UNIVERSITY OF TECHNOLOGY   (Slovakia)

^b Faculty of Natural Sciences   (Slovakia)

Author keywords

Si3N4; Testing; Thermal shock resistance

Indexed keywords

COMPUTER SIMULATION; LEAST SQUARES APPROXIMATIONS; SHOCK TESTING; THERMAL STRESS;

PARAMETER OF INFLUENCE; TEMPERATURE DIFFERENCE; THERMAL SHOCK RESISTANCE;

SILICON NITRIDE;

COMPUTER SIMULATION; LEAST SQUARES APPROXIMATIONS; SHOCK TESTING; SILICON NITRIDE; THERMAL STRESS;

EID: 33751539837     PISSN: 09552219     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jeurceramsoc.2006.07.024     Document Type: Article

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