Reliability growth and forecasting for critical hardware through accelerated life testing

Bell Labs Technical Journal

Volumn 11, Issue 3, 2006, Pages 121-135

  Acevedo, Pablo E ^a   Jackson, Donald S ^a,b   Kotlowitz, Robert W ^a,b,c  

^a NOKIA RESEARCH CENTER   (United States)

^b Lucent Technologies Reliability Engineering Department ^*

^c ASME

Author keywords

[No Author keywords available]

Indexed keywords

ACCELERATED LIFE TESTING (ALT); STATISTICAL INFORMATION; SUPPORTING MODELS; SYSTEM RELIABILITY;

COMPUTER HARDWARE; COMPUTER SIMULATION; MATHEMATICAL MODELS; POWER AMPLIFIERS; RELIABILITY; STATISTICAL METHODS;

TELECOMMUNICATION SYSTEMS;

EID: 33751513099     PISSN: 10897089     EISSN: 15387305     Source Type: Journal    
DOI: 10.1002/bltj.20183     Document Type: Article

References (19)

1. T. Caulfield, J. A. Benenati, and J. Acocella, "Surface Mount Array Interconnections for High I/O MCM-C to Card Assemblies," Proc. Internat. Conf. on Multichip Modules (Denver, CO, 1993), pp. 320-325.
2. L. H. Crow, "Reliability Analysis for Complex, Repairable Systems," Reliability and Biometry: Statistical Analysis of Lifelength (F. Proschan and R. J. Serfling, eds.), Society for Industrial and Applied Mathematics (SIAM), Philadelphia, PA, 1974, pp. 379-410.
3. L. H. Crow, "Evaluating the Reliability of Repairable Systems," Proc. Annual Reliability and Maintainability Symposium (Los Angeles, CA, 1990), pp. 275-279.
4. R. P. Erdman, D.S. Jackson, and R. W. Kotlowitz, "Accelerated Life Testing of Power Transistors as Part of a Product Assurance Process for RF Amplifiers," Proc. Accelerated Stress Testing Workshop (AST '00), IEEE Components, Packaging and Manufacturing Technol. Society (Denver, CO, 2000), pp.261-267.
5. H. R. Falaki, W. Kamm, and R. W. Kotlowitz, "Comprehensive Environmental Stress Testing Process for an Outside-Plant GSM Base-Station System," Proc. Accelerated Stress Testing Workshop (AST '99), IEEE Components, Packaging and Manufacturing Technol. Society (Boston, MA, 1999), pp. 199-204.
6. R. D. Gerke and G. B. Kromann, "The Effect of Solder-Joint Temperature Rise on Ceramic-Ball-Grid Array to Board Interconnection Reliability: The Motorola PowerPC 603 and PowerPC 604 Microprocessors and MPC 105 Bridge/Memory Controller," Proc. Interpack '95 (Lahaina, HI, 1995), 〈http://www.flomerics.com/flotherm/technical_papers/t96.pdf〉.
7. J. S. Hwang, Modern Solder Technology for Competitive Electronics Manufacturing, McGraw-Hill, New York, 1996.
8. F. Jensen and N. E. Petersen, Burn-In: An Engineering Approach to the Design and Analysis of Burn-In Procedures, John Wiley, Chichester, UK, New York, 1982.
9. T. Joyce, J. Donovan, and E. Murphy, "The Application of the Box-Tidwell Transformation in Reliability Modeling," Proc. Reliability and Maintainability Symposium (RAMS '06) (Newport Beach, CA, 2006).
10. D. Kececioglu and F.-B. Sun, Environmental Stress Screening: Its Quantification, Optimization and Management, Prentice Hall, Upper Saddle River, NJ, 1995.
11. D. J. Klinger, Y. Nakada, and M. A. Menendez, AT&T Reliability Manual, Van Nostrand Reinhold, New York, 1990.
12. R. W. Kotlowitz, "Comparative Compliance of Representative Lead Designs for Surface Mounted Components," Proc. Internat. Electronics Packaging Society Conf. (Dallas, TX, 1988), pp. 908-948.
13. R. W. Kotlowitz and K. K. Ng, "Platform Program for Supplier Product Assurance Through Accelerated Stress Testing and Reviews," Proc. QuEST Forum (Quality Excellence for Suppliers of Telecommun.) Best Practices Conf. (San Jose, CA, 2005), 〈http://www.questforum.org〉.
14. J. H. Lau (ed.), Solder Joint Reliability: Theory and Applications, Van Nostrand Reinhold, New York, 1991.
15. W. Nelson, Accelerated Testing: Statistical Models, Test Plans, and Data Analyses, John Wiley, New York, 1990.
16. K. C. Norris and A. H. Landzberg, "Reliability of Controlled Collapse Interconnections," IBM J. Res. Dev., 13:3 (1969), 266-271.
17. P.D.T. O'Connor, Practical Reliability Engineering, 2nd ed., John Wiley, Chichester, UK, New York, 1985, p. 47, equation (2.43).
18. T. P. Parker and G. L. Harrison, "Quality Improvement Using Environmental Stress Testing," AT&T Tech. J., 71:4 (1992), 10-23.
19. United States Department of Defense, "Environmental Stress Screening (ESS) of Electronic Equipment," Military Handbook MIL-HDBK-344A, Aug. 16, 1993.