Graphite foam/copper composite substrate for electronic cooling

Collection of Technical Papers - 4th International Energy Conversion Engineering Conference

Volumn 1, Issue , 2006, Pages 593-602

  Vrable, Daniel L ^a,c,d   Gottschlich, Joseph M ^b,d  

^a TMMT Inc   (United States)

^b AIR FORCE RESEARCH LABORATORY   (United States)

^c AIAA ^*  (United States)

^d AIAA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; COPPER; FOAMS; GRAPHITE; HEAT SINKS; INFILTRATION; MICROSTRUCTURE; THERMAL EXPANSION;

COPPER COMPOSITE; ELECTRONIC COMPONENTS; TEMPERATURE GRADIENTS;

NONMETALLIC MATRIX COMPOSITES;

EID: 33751424899     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.2514/6.2006-4071     Document Type: Conference Paper

References (6)

1. Stevenson, S., ''LDMOS Devices Generate High Power tor TDMA, CDMA and W-CDMA," Applied Microwave & Wireless, March 2000. pp 96 - 98.
2. Vrable, D. L. and Gottschlich, J. M., "Graphite Foam/Copper Composite Substrate for Electronic Cooling," 2006 IAPG Mechanical Working Group Conference, NASA Glenn Research Center, Cleveland, OH, May 22-24, 2006, pp. 103-115
3. Klett, J. W., "Mesophase Pitch-Based Carbon Foam: Effects of Precursor on Thermal Conductivity," Proceeding of the 23'rd Annual Conference on Ceramic, Metal and Carbon Composites, Materials and Structures Symposium, Cocoa Beach, FL, January 25-29, 1999, pp. 657-674.
4. McCoy, J. W. and Vrable, D. L., "Metal-Matrix Composites from Graphitic Foams and Copper," SAMPE Journal, Vol. 40, No. 1, January/February 2004, pp. 7-15.
5. Browne, J., "LDMOS FETs Power WiMAX Base Stations," Microwave & RF, Vol. 45, No.4, p 92, April 2006.
6. ALGOR, Finite Element Analysis and Event Simulation, Software Package, Ver. 14.0, Pittsburgh, PA, 2006.