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Volumn 55, Issue 1, 2007, Pages 141-147

A semi-analytical method to compute surface elastic properties

Author keywords

Analytical methods; Molecular dynamics; Surface elasticity; Surface energy

Indexed keywords

ELASTICITY; INTERFACIAL ENERGY; MOLECULAR DYNAMICS; STIFFNESS; SURFACE PROPERTIES; TENSORS;

EID: 33751411666     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2006.08.007     Document Type: Article
Times cited : (85)

References (44)
  • 11
    • 79957914865 scopus 로고    scopus 로고
    • Thermomechanical reliability of microelectronic packaging
    • Gerberich W., and Yang W. (Eds), Elsevier Science
    • Qu J. Thermomechanical reliability of microelectronic packaging. In: Gerberich W., and Yang W. (Eds). Comprehensive structure integrity - fracture of materials from nano to macro (2003), Elsevier Science 219
    • (2003) Comprehensive structure integrity - fracture of materials from nano to macro , pp. 219
    • Qu, J.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.