Structural effect of phenalkamines on adhesive viscoelastic and thermal properties of epoxy networks

Journal of Applied Polymer Science

Volumn 102, Issue 5, 2006, Pages 4741-4748

  Pathak, Sandeep K ^a   Rao, B S ^a  

^a INDIAN INSTITUTE OF CHEMICAL TECHNOLOGY   (India)

Author keywords

Adhesive; Dynamic mechanical thermal analysis; Epoxy; Phenalkamine; Thermal properties

Indexed keywords

CURING; HIGH PRESSURE LIQUID CHROMATOGRAPHY; NUCLEAR MAGNETIC RESONANCE; THERMOGRAVIMETRIC ANALYSIS; VISCOELASTICITY;

CURING AGENTS; EPOXY NETWORKS; PHENALKAMINE;

EPOXY RESINS;

ADHESIVE PROPERTY; EPOXY RESIN; POLYAMINE; POLYETHYLENE; THERMAL ANALYSIS; THERMAL PROPERTY; VISCOELASTICITY;

EID: 33751242711     PISSN: 00218995     EISSN: 10974628     Source Type: Journal    
DOI: 10.1002/app.25005     Document Type: Article

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