The effects of bond thickness, rate and temperature on the deformation and fracture of structural adhesives under shear loading

International Journal of Fracture

Volumn 130, Issue 1, 2004, Pages 497-515

  Chai, Herzl ^a  

^a TEL AVIV UNIVERSITY   (Israel)

Author keywords

Adhesive bond; Flaw distribution; Fracture; Rate; Temperature; Yield

Indexed keywords

CRACKS; DEFECTS; DEFORMATION; FRACTURE; MATHEMATICAL MODELS; MECHANICAL PROPERTIES; STRAIN RATE; THERMAL EFFECTS;

ADHESIVE BONDS; FLAW DISTRIBUTION; MOLECULAR ACTIVATION MODELS; STRUCTURAL ADHESIVES;

ADHESIVES;

EID: 33751183987     PISSN: 03769429     EISSN: 15732673     Source Type: Journal    
DOI: 10.1023/B:FRAC.0000049504.51847.2a     Document Type: Article

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