High-damping properties of Mn-Cu sintered alloys

Materials Science and Engineering: A

Volumn 442, Issue 1-2 SPEC. ISS., 2006, Pages 439-443

  Fukuhara, Mikio ^a   Yin, Fuxing ^b   Ohsawa, Yoshiaki ^b   Takamori, Susumu ^b  

^a TOHOKU UNIVERSITY   (Japan)

^b NATIONAL INSTITUTE FOR MATERIALS SCIENCE   (Japan)

Author keywords

High damping alloys; Martensitic transformation; Mn Cu alloys; Twin boundaries

Indexed keywords

DAMPING; GRAIN BOUNDARIES; MARTENSITIC TRANSFORMATIONS; QUENCHING; SINTERING;

HIGH DAMPING ALLOYS; SINTERED ALLOYS; TWIN BOUNDARIES;

BINARY ALLOYS;

BINARY ALLOYS; DAMPING; GRAIN BOUNDARIES; MARTENSITIC TRANSFORMATIONS; QUENCHING; SINTERING;

EID: 33751114209     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2006.05.163     Document Type: Article

References (18)

1. Worrell F.T. J. Appl. Phys. 19 (1948) 929-933
2. Siefert A.V., and Worrell F.T. J. Appl. Phys. 22 (1951) 1257-1259
3. Birchon D., Bromley D.E., and Healey D. Met. Sci. J. 2 (1968) 41-46
4. Vintaykin Y.Z., Litvin D.F., and Udovenko V.A. Phys. Met. Metallogr. 37 (1974) 1228-1237
5. Sugimoto K., Mori T., and Shiode S. Met. Sci. J. 7 (1973) 103-108
6. Hedley J.A. Met. Sci. J. 2 (1968) 129-137
7. Aoyagi Y., and Sumino K. Phys. Status Solidi 33 (1969) 317-326
8. Adachi K., Yamashita T., Taneda Y., Farkas D.M., and Perkins J. Philos. Mag. A 73 (1969) 1009-1034
9. Wu Q., Yin F.X., and Hono K. Scripta Mater. 46 (2002) 717-722
10. Laddha S., and Van Aken D.C. Metall. Mater. Trans. A 26 (1995) 957-964
11. Yin F., Ohsawa Y., Sato A., and Kawahara K. Z. Metallkd. 39 (1998) 841-848
12. Yin F., Ohsawa Y., Sato A., and Kawahara K. Acta Mater. 48 (2000) 1273-1282
13. Fukuhara M., Yin F., and Kawahara K. Phys. Status Solidi (a) 201 (2004) 454-458
14. K. Kawahara, Japan Patent No. 2849698.
15. Kubo R. Rubber Elasticity (1996), Shokabo, Tokyo p. 78 (in Japanese)
16. Fukuhara F., and Yamauchi I. J. Mater. Sci. 28 (1993) 4681-4688
17. Fukuhara M., and Yin F. Phys. Status Solidi (a) 201 (2004) 459-466
18. Smith J.H., and Vance E.R. J. Appl. Phys. 40 (1969) 4853-4858