메뉴 건너뛰기




Volumn 27, Issue 5, 2006, Pages 899-902

Machining method on electroplated diamond wire saw with ultrasonic vibration

Author keywords

Diamond wire saw; Hard and brittle material; Manufacturing process and equipment; Surface quality; Ultrasonic machining

Indexed keywords

BRITTLENESS; DIAMONDS; ELECTROPLATING; HARDNESS; SURFACES; ULTRASONIC CUTTING; VIBRATIONS (MECHANICAL); WIRE;

EID: 33751113308     PISSN: 10001093     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article
Times cited : (8)

References (10)
  • 1
    • 33751109202 scopus 로고    scopus 로고
    • The research actualities and development of the diamond wire saw
    • in Chinese
    • ZHOU Rui, LI Jian-feng, et al. The research actualities and development of the diamond wire saw [J]. Modern Manufacture Engineering, 2004, (6): 112-115. (in Chinese)
    • (2004) Modern Manufacture Engineering , Issue.6 , pp. 112-115
    • Zhou, R.1    Li, J.-F.2
  • 2
    • 33751102083 scopus 로고
    • Multiple wire saw cutting device
    • in Chinese
    • Kojima. Multiple wire saw cutting device [J]. Sumitomo Search, 1993, 52: 228-230. (in Chinese)
    • (1993) Sumitomo Search , vol.52 , pp. 228-230
    • Kojima1
  • 3
    • 33751113223 scopus 로고    scopus 로고
    • Diamond profiling saw for machining glass and naturalstone
    • Anker A. Diamond profiling saw for machining glass and naturalstone [J]. IDR, 1999, 59 (4): 287-290.
    • (1999) IDR , vol.59 , Issue.4 , pp. 287-290
    • Anker, A.1
  • 4
    • 33751111899 scopus 로고    scopus 로고
    • Diamond wire solves cutting challenge
    • Russ P, Bueb A. Diamond wire solves cutting challenge [J]. IDR, 1997, 57 (1): 26-31.
    • (1997) IDR , vol.57 , Issue.1 , pp. 26-31
    • Russ, P.1    Bueb, A.2
  • 5
    • 33751072324 scopus 로고
    • Precision cutting with diamond wire saw
    • Malanghlia Hab. Precision cutting with diamond wire saw [J]. Cut Tool Eng, 1986, 377-381.
    • (1986) Cut Tool Eng , pp. 377-381
    • Hab, M.1
  • 6
    • 33751087445 scopus 로고
    • High speed and ultra-precision cutting with wire saw in single road
    • Anderson J R. High speed and ultra-precision cutting with wire saw in single road [J]. Precision Manufacture, 1990, 56 (6): 1052-1057.
    • (1990) Precision Manufacture , vol.56 , Issue.6 , pp. 1052-1057
    • Anderson, J.R.1
  • 7
    • 33751081486 scopus 로고    scopus 로고
    • Fixed abrasive diamond wire machining Part I: Process monitoring and wire tension force
    • Clark W I, Shih A J, Hardin C W, et al. Fixed abrasive diamond wire machining part I: process monitoring and wire tension force [J]. International Journal of Machine Tools and Manufacture, 2003, 45 (5): 259-263.
    • (2003) International Journal of Machine Tools and Manufacture , vol.45 , Issue.5 , pp. 259-263
    • Clark, W.I.1    Shih, A.J.2    Hardin, C.W.3
  • 8
    • 33751117450 scopus 로고    scopus 로고
    • Fixed abrasive diamond wire machining Part II: Process monitoring and wire tension force
    • Clark W I, Shih A J, Hardin C W, et al. Fixed abrasive diamond wire machining part II: process monitoring and wire tension force [J]. International Journal of Machine Tools and Manufacture, 2003, 43 (5): 196-201.
    • (2003) International Journal of Machine Tools and Manufacture , vol.43 , Issue.5 , pp. 196-201
    • Clark, W.I.1    Shih, A.J.2    Hardin, C.W.3
  • 9
    • 33751087163 scopus 로고    scopus 로고
    • Study on surface damage in linecutting silicon
    • in Chinese
    • FAN Rui-xin, LU Huan-ming. Study on surface damage in linecutting silicon [J]. Materials Science and Engineering, 1999, 17 (2): 55-57. (in Chinese)
    • (1999) Materials Science and Engineering , vol.17 , Issue.2 , pp. 55-57
    • Fan, R.-X.1    Lu, H.-M.2
  • 10
    • 33751080576 scopus 로고    scopus 로고
    • The mechanism study of circle diamond line saw in cutting granite
    • in Chinese
    • GAO Wei, HOU Jun-ying, Liu Ying. The mechanism study of circle diamond line saw in cutting granite [J]. Modern Manufacture Engineering, 2005, (5): 73-75. (in Chinese)
    • (2005) Modern Manufacture Engineering , Issue.5 , pp. 73-75
    • Gao, W.1    Hou, J.-Y.2    Liu, Y.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.