The high-temperature damping background in intermetallic alloys

Materials Science and Engineering: A

Volumn 442, Issue 1-2 SPEC. ISS., 2006, Pages 138-141

  Weller, M ^a   Clemens, H ^b   Haneczok, G ^c  

^a MAX PLANCK INSTITUTE FOR INTELLIGENT SYSTEMS   (Germany)

^b UNIVERSITY OF LEOBEN   (Austria)

^c UNIVERSITY OF SILESIA   (Poland)

Author keywords

Decagonal Al Ni Co quasicrystals; Diffusion creep; Dislocation climb; High temperature damping; NiAl; TiAl

Indexed keywords

ACTIVATION ENERGY; CREEP; DAMPING; DISLOCATIONS (CRYSTALS); ENTHALPY; HIGH TEMPERATURE PROPERTIES; NICKEL ALLOYS; QUASICRYSTALS; SINGLE CRYSTALS; TITANIUM ALLOYS;

ACTIVATION ENTHALPIES; DIFFUSION CREEP; DISLOCATION CLIMB; HIGH-TEMPERATURE DAMPING BACKGROUND;

INTERMETALLICS;

ACTIVATION ENERGY; CREEP; DAMPING; DISLOCATIONS (CRYSTALS); ENTHALPY; HIGH TEMPERATURE PROPERTIES; INTERMETALLICS; NICKEL ALLOYS; QUASICRYSTALS; SINGLE CRYSTALS; TITANIUM ALLOYS;

EID: 33751080429     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2006.02.220     Document Type: Article

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