The North American opinion climate for nanotechnology and its products: Opportunities and challenges

Journal of Nanoparticle Research

Volumn 8, Issue 5, 2006, Pages 563-568

  Priest, Susanna ^a  

^a UNIVERSITY OF SOUTH CAROLINA   (United States)

Author keywords

Canada; North America; Public engagement; Public opinion; Risk communication; Societal implications of nanotechnology; United States

Indexed keywords

DATA REDUCTION; RISK ASSESSMENT; SOCIAL ASPECTS; TECHNOLOGY TRANSFER;

PUBLIC ENGAGEMENT; RISK COMMUNICATION; TYPOLOGY;

NANOTECHNOLOGY;

EID: 33751001056     PISSN: 13880764     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11051-005-9060-7     Document Type: Article

References (8)

1. Bishop G.F., 2004. The Illusion of Public Opinion: Fact and Artifact in American Public Opinion Polls. Rowman & Littlefield.
2. Cobb M. & J. Macoubrie, 2004. Public attitudes toward nanotechnology. J. Nanoparticle Res. 6, 395-405.
3. Gaskell G., T. Ten Eyck, J. Jackson & G. Veltri, 2005. Imagining nanotechnology: Cultural support for innovation in Europe and the United States. Public Underst. Sci. 14(1), 81-90.
4. Priest S., 2001. Misplaced faith: Communication variables as predictors of encouragement for biotechnology development. Sci. Commun. 23(2), 97-110.
5. Priest S., 2005. International audiences for news of emerging technologies: Canadian and U.S. responses to bio- and nanotechnologies. In First Impressions: Understanding the Public's View of Emerging Technologies. Genome Prairie GE3LS Team, University of Calgary. Report prepared for Canadian Biotechnology Secretariat (September), pp. 77-87.
6. Priest S., 2006. The public opinion climate for gene technologies in Canada and the United states: Competing voices, contrasting frames. Public Underst. Sci. 15(1), 55-71.
7. Royal Society and Royal Academy of Engineering, 2004. Nanoscience and Nanotechnologies: Opportunities and Uncertainties (July).
8. Sturgis P. & N. Allum, 2004. Science in society: Re-evaluating the deficit model of public attitudes. Public Underst. Sci. 13, 55-74.