Aging and solid or liquid behavior in pastes

Journal of Rheology

Volumn 50, Issue 6, 2006, Pages 975-994

  Coussot, P ^a   Tabuteau, H ^b   Chateau, X ^a   Tocquer, L ^a   Ovarlez, G ^a  

^a UNIVERSITÉ PARIS EST   (France)

^b UNIVERSITY OF WESTERN ONTARIO   (Canada)

Author keywords

Aging; Elastic modulus; Pastes; Shear banding; Solid liquid transition

Indexed keywords

AGING OF MATERIALS; CREEP; ELASTIC MODULI; STRESS CONCENTRATION; YIELD STRESS;

AGING; PASTES; SHEAR-BANDING; SOLID-LIQUID TRANSITION; THIXOTROPY;

ADHESIVE PASTES;

EID: 33750916560     PISSN: 01486055     EISSN: None     Source Type: Journal    
DOI: 10.1122/1.2337259     Document Type: Article

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