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Volumn 515, Issue 4, 2006, Pages 2295-2302
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Photoresist etching using Ar/O2 and He/O2 atmospheric pressure plasma
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Author keywords
Dielectrics; Etching; Glow discharge; Surface roughness
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Indexed keywords
DIELECTRIC MATERIALS;
ETCHING;
GLOW DISCHARGES;
HYDROPHILICITY;
OXYGEN;
PHOTORESISTS;
SILICON WAFERS;
SURFACE ROUGHNESS;
ATMOSPHERIC PRESSURE PLASMA;
PLASMA DISCHARGES;
RADIO FREQUENCY (RF) POWER;
PLASMAS;
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EID: 33750910916
PISSN: 00406090
EISSN: None
Source Type: Journal
DOI: 10.1016/j.tsf.2006.03.030 Document Type: Article |
Times cited : (32)
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References (24)
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