Automated detection of micro void in solder bump

IEEJ Transactions on Industry Applications

Volumn 126, Issue 11, 2006, Pages

  Teramoto, Atsushi ^a,d   Murakoshi, Takayuki ^a,d   Tsuzaka, Masatoshi ^b   Fujita, Hiroshi ^c  

^a Nagoya Electric Works Co Ltd   (Japan)

^b NAGOYA UNIVERSITY   (Japan)

^c GIFU UNIVERSITY   (Japan)

^d Nagoya Electric Works Co Ltd   (Japan)

Author keywords

Bump; Inspection; Solder; Void; X rays

Indexed keywords

ELECTRIC PROPERTIES; IMAGE ANALYSIS; INSPECTION; RELIABILITY; SEMICONDUCTOR JUNCTIONS; SOLDERING ALLOYS; X RAY SPECTROSCOPY;

AUTOMATED DETECTION; MICRO VOID; SOLDER BUMP;

AUTOMOBILE BUMPERS;

EID: 33750898116     PISSN: 09136339     EISSN: 13488163     Source Type: Journal    
DOI: 10.1541/ieejias.126.1514     Document Type: Article

References (9)