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Volumn 515, Issue 4, 2006, Pages 1881-1885

Surface and grain boundary contributions in the electrical resistivity of metallic nanofilms

Author keywords

Atomic force microscopy; Electrical properties and measurements; Grain boundary; Metals

Indexed keywords

ATOMIC FORCE MICROSCOPY; ELECTRIC CONDUCTIVITY; EVAPORATION; GRAIN BOUNDARIES; METAL ANALYSIS; NANOSTRUCTURED MATERIALS; SURFACE STRUCTURE;

FILM THICKNESS; GRAIN BOUNDARY REFLECTION (R) COEFFICIENTS; LOGNORMAL BEHAVIOR; THERMAL EVAPORATION;

METALLIC FILMS;

EID: 33750845061 PISSN: 00406090 EISSN: None Source Type: Journal
DOI: 10.1016/j.tsf.2006.07.024 Document Type: Article

Times cited : (103)

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