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Volumn 56, Issue 10, 2006, Pages 20-25

Effects of panel density and mat moisture content on processing medium density fiberboard

Author keywords

[No Author keywords available]

Indexed keywords

INTERNAL BONDING; PANEL DENSITY; RESIN CURING; STEAM PRESSURE;

EID: 33750800642     PISSN: 00157473     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article
Times cited : (33)

References (17)
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    • Frazier, C.E. 2004. Monitoring resin cure in the mat for hot-compression modeling. In: Proc. Fundamentals of Composite Processing. J. Winandy and F.A. Kamke, eds. Gen. Tech. Rept. FPL-GTR-149. USDA Forest Serv., Forest Products Lab. Madison, WI. pp. 26-28.
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  • 5
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.