Study of hole-machining on pyrex wafer by Electrochemical Discharge Machining (ECDM)

Materials Science Forum

Volumn 505-507, Issue PART 2, 2006, Pages 1207-1212

  Liao, Yunn Shiuan ^a   Peng, Wen Yang ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

Biological chips; Bonding process; ECDM; Electrochemical discharge machining; Micro fluidic channels; Pyrex wafer

Indexed keywords

CHIP SCALE PACKAGES; ELECTRIC DISCHARGES; ELECTROLYTES; RATE CONSTANTS; VOLTAGE CONTROL;

BIOLOGICAL CHIPS; BONDING PROCESSES; ELECTROCHEMICAL DISCHARGE MACHINING (ECDM); MICRO FLUIDIC CHANNELS; PYREX WAFER;

ELECTROCHEMISTRY;

EID: 33750603753     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/0-87849-990-3.1207     Document Type: Conference Paper

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