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Volumn 19, Issue 5, 2006, Pages 245-257

Heat sealing measurement by an innovative technique

Author keywords

Fusion temperature; Heat seal; Melting temperature; Peelable seal

Indexed keywords

HEATING; MELTING; THERMOCOUPLES;

EID: 33750596950     PISSN: 08943214     EISSN: 10991522     Source Type: Journal    
DOI: 10.1002/pts.728     Document Type: Article
Times cited : (24)

References (8)
  • 1
    • 0028762284 scopus 로고
    • Heat sealing of semicrystalline polymer films. I. Calculation and measurements of interfacial temperatures: Effect of process variables on seal properties
    • [DOI: 10.1002/app.1994.070510111].
    • Meka P, Stehling F. Heat sealing of semicrystalline polymer films. I. Calculation and measurements of interfacial temperatures: effect of process variables on seal properties. J. Appl. Polym. Sci. 1994; 51: 89-103 [DOI: 10.1002/app.1994.070510111].
    • (1994) J. Appl. Polym. Sci. , vol.51 , pp. 89-103
    • Meka, P.1    Stehling, F.2
  • 3
    • 0024478795 scopus 로고
    • Heat sealability of flexible web materials in hot-bar sealing applications
    • Theller HW. Heat sealability of flexible web materials in hot-bar sealing applications. J. Plastic Film Sheeting 1989; 5: 66-93.
    • (1989) J. Plastic Film Sheeting , vol.5 , pp. 66-93
    • Theller, H.W.1
  • 4
    • 23844440679 scopus 로고    scopus 로고
    • The effect of heat sealing temperature on the properties of OPP/CPP heat seal. I. Mechanical properties
    • DOI: 10.1002/app.21320
    • Tetsuya T, Ishiaku US, Mizoguchi M, Hamada H. The effect of heat sealing temperature on the properties of OPP/CPP heat seal. I. Mechanical properties. J. Appl. Polym. Sci. 2005; 97: 753-760 [DOI: 10.1002/app.21320].
    • (2005) J. Appl. Polym. Sci. , vol.97 , pp. 753-760
    • Tetsuya, T.1    Ishiaku, U.S.2    Mizoguchi, M.3    Hamada, H.4
  • 5
    • 33750592579 scopus 로고    scopus 로고
    • Method of designing heat-seal width
    • 073159000 (USPTO), G01N019/04 (Intl Class), USPTO Patent Full-text and Image Database US Patent 20040255664, US; 2001
    • Hishinuma K. Method of designing heat-seal width. 073159000 (USPTO), G01N019/04 (Intl Class). USPTO Patent Full-text and Image Database US Patent 20040255664, 2004. US; 2001.
    • (2004)
    • Hishinuma, K.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.