Fracture toughness and high temperature strength of unidirectionally solidified Nb-Si binary and Nb-Ti-Si ternary alloys

Journal of Alloys and Compounds

Volumn 425, Issue 1-2, 2006, Pages 223-229

  Sekido, Nobuaki ^a   Kimura, Yoshisato ^a   Miura, Seiji ^b   Wei, Fu Gao ^c   Mishima, Yoshinao ^a  

^a TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

^b HOKKAIDO UNIVERSITY   (Japan)

^c NATIONAL INSTITUTE FOR MATERIALS SCIENCE   (Japan)

Author keywords

Intermetallics; Scanning electron microscopy; Strain; Unidirectional solidification

Indexed keywords

COMPRESSIVE STRENGTH; CRYSTAL GROWTH; EUTECTICS; FRACTURE TOUGHNESS; MATHEMATICAL MODELS; SOLIDIFICATION; TERNARY SYSTEMS;

CRACK DEFLECTION; OPTICAL FLOATING ZONE; SOLIDIFIED ALLOYS; UNIDIRECTIONAL SOLIDIFICATION;

BINARY ALLOYS;

EID: 33750530192     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2006.01.071     Document Type: Article

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