Methodology of optimization for MicroChannel heat exchanger

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn 2006, Issue , 2006, Pages 65-68

  Park, HeeSung ^a   Jo, Ngln ^a   Chang, JaeYoung ^a   Kim, SunSoo ^a  

^a SAMSUNG Electronics   (South Korea)

Author keywords

Heat exchanger; Microchannel; Thermal resistance

Indexed keywords

CHANNEL FLOW; COOLING; CURRENT DENSITY; HEAT RESISTANCE; INTEGRATED CIRCUIT LAYOUT; OPTIMIZATION;

HEAT GENERATION; LIQUID COOLING; MICROCHANNEL; MICROCHANNEL HEAT EXCHANGER;

HEAT EXCHANGERS;

EID: 33750111100     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. Garimella, S. V., Joshi, Y. K., Bar-Cohen, A., Mahajan, R., Toh, K. C., Carey, V. P., Baelmans, M., Lohan, J., Sammakia, B., and Andros, F., 2002, "Thermal Challenges in Next Generation Electronic Systems - Summary of Panel Presentations and Discussions," IEEE Trans. Compon. Packaging Tech., Vol. 25, pp. 569-575, 2002
2. Harms, T. M., Kazmierczak, M J., Gerner, F. M., "Developing Convective Heat Transfer in Deep Rectangular Microchannels," Int. J. Heat Fluid Flow, Vol. 20, pp. 149-157, 1999.
3. Meysenc, L., Saludjian, L., Bricard, A., Rael, S., Schaeffer, C., "A High Heat Flux IGBT Micro Exchanger Setup," IEEE Trans. Components, Hybrids, and Manufacturing Tech., Vol. 20, pp. 334-341, 1997.
4. Knight, R. W., Hall, D. J., Goodling, J. S., Jaeger, R. C., "Heat Sink Optimization with Application to Microchannels," IEEE Trans. Components, Hybrids, and Manufacturing Tech., Vol. 15, pp. 835-842, 1992.
5. Copeland, D., "Optimization of Parallel Plate Heatsinks for Forced Convection," Proc. 16th IEEE Semiconductor Thermal Measurement and Management Symp. pp. 266-272, 2000.