Reducing hot spots and junction temperatures of integrated circuits using carbon composite in a printed circuit board and substrate

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn 2006, Issue , 2006, Pages 237-239

  Vasoya, Kris ^a  

^a Thermal Works LP   (United States)

Author keywords

Carbon Composite Laminates; Coefficient of Thermal Expansion (CTE); Conduction cooling; Convection cooling; Rigidity; Thermal Conductivity

Indexed keywords

CARBON COMPOSITE LAMINATES; CARBON COMPOSITES; CONDUCTION COOLING; CONVECTION COOLING;

CARBON FIBER REINFORCED PLASTICS; HEAT CONDUCTION; LAMINATED COMPOSITES; PRINTED CIRCUIT BOARDS; RIGIDITY; SEMICONDUCTOR JUNCTIONS; THERMAL EXPANSION;

INTEGRATED CIRCUITS;

EID: 33750098560     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. "Material Characterization and Die Stress Measurement of Low Expansion PCB for Extreme Environments," D.Scott Copeland, M Kaysar Rahim, M Saiful Islam, Jeffrey C Suhling, Richard C Jaeger, Pradeep lall and Guoyun Tian, Department of Mechanical Engineering, Department of Electrical and Computer Engineering, Auburn University, Auburn, AL 36849
2. Vishay Measurements Group Guide to Strain Measurement Technology,
3. Tech Notes TN-513