Packaging technology for ultra-small variable optical attenuator multiplexer (V-AWG) with multichip PLC integration structure using chip-scale-package PD array

IEEE Journal on Selected Topics in Quantum Electronics

Volumn 12, Issue 5, 2006, Pages 1045-1052

  Ogawa, Ikuo ^a,b   Doi, Yoshiyuki ^b   Hashizume, Yasuaki ^b   Kamei, Shin ^b   Tamura, Yasuaki ^b   Ishii, Motohaya ^b   Kominato, Toshimi ^a,b   Yamazaki, Hiroshi ^b   Kaneko, Akimasa ^b  

^a IEEE   (Japan)

^b NTT CORPORATION   (Japan)

Author keywords

Chip scale package photodiode (PD) array; Multichip planar lightwave circuit (PLC) integration; Silica based PLC; Variable optical attenuator multiplexer

Indexed keywords

CHIP SCALE PACKAGE PHOTODIODE (PD) ARRAY; MULTICHIP PLANAR LIGHTWAVE CIRCUIT (PLC) INTEGRATION; SILICA BASED PLC; VARIABLE OPTICAL ATTENUATOR MULTIPLEXERS;

ATTENUATION; LIGHT POLARIZATION; MULTIPLEXING; PHOTODIODES; PROGRAMMABLE LOGIC CONTROLLERS;

ELECTRONICS PACKAGING;

EID: 33749873685     PISSN: 1077260X     EISSN: None     Source Type: Journal    
DOI: 10.1109/JSTQE.2006.882627     Document Type: Article

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