The role of temperature in copper electrocrystallization in ammonia-chloride solutions

Electrochimica Acta

Volumn 52, Issue 3, 2006, Pages 892-903

  Vazquez Arenas, Jorge ^a   Cruz, Roel ^a   Mendoza Huizar, Luis H ^b  

^a UNIVERSIDAD AUTÓNOMA DE SAN LUIS POTOSÍ   (Mexico)

^b UNIVERSIDAD AUTÓNOMA DEL ESTADO DE HIDALGO   (Mexico)

Author keywords

Adsorption; Copper; Electrocrystallization; Kinetics; Temperature

Indexed keywords

AMMONIA CHLORIDE SOLUTIONS; CURRENT TRANSIENTS ANALYSES; ELECTROCHEMICAL TECHNIQUES; ELECTROCRYSTALLIZATION;

ACTIVATION ENERGY; AMMONIUM COMPOUNDS; COPPER; ELECTROCHEMISTRY; NUCLEATION; REACTION KINETICS; SCANNING ELECTRON MICROSCOPY; STAINLESS STEEL; THERMAL EFFECTS;

CRYSTALLIZATION;

EID: 33749588491     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2006.06.022     Document Type: Article

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