Effect of Cu(II) ligands on electroless copper deposition rate in formaldehyde solutions: An EQCM study

Journal of Applied Electrochemistry

Volumn 36, Issue 11, 2006, Pages 1261-1269

  PauliukaitE R ^a   Stalnionis, G ^a   Jusys, Z ^b   Vaskelis A ^a  

^a CENTER FOR PHYSICAL SCIENCES AND TECHNOLOGY   (Lithuania)

^b UNIVERSITY OF ULM   (Germany)

Author keywords

Copper; Copper(II) complexes; Electroless deposition; EQCM; Formaldehyde

Indexed keywords

COPPER; FORMALDEHYDE; GLYCEROL; MOLECULAR STRUCTURE; REDUCTION;

COPPER(II) COMPLEXES; EQCM; QUADROL;

ELECTROLESS PLATING;

EID: 33749323693     PISSN: 0021891X     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10800-006-9180-5     Document Type: Article

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