Influence of plasma treatment on the electroless deposition of copper on carbon fibers

Journal of Macromolecular Science, Part A: Pure and Applied Chemistry

Volumn 43, Issue 11, 2006, Pages 1853-1865

  Zhu, Qunyu ^a   Sun, Junfen ^a   He, Chunju ^a   Zhang, Jing ^a   Wang, Qingrui ^a  

^a DONGHUA UNIVERSITY   (China)

Author keywords

Carbon fibers; Copper film deposition; Plasma treatment

Indexed keywords

ADHESION; CARBON FIBERS; COPPER COMPOUNDS; DISCHARGE (FLUID MECHANICS); ELECTROLESS PLATING; SCANNING ELECTRON MICROSCOPY; SURFACE ROUGHNESS; X RAY PHOTOELECTRON SPECTROSCOPY;

CARBON FIBER SURFACES; COPPER FILM DEPOSITION; DISCHARGE PRESSURES; PLASMA TREATMENT;

PLASMA APPLICATIONS;

EID: 33749027213     PISSN: 10601325     EISSN: 15205738     Source Type: Journal    
DOI: 10.1080/10601320600941235     Document Type: Conference Paper

References (33)

1. Haga, O., Koyama, H., and Kawada, K. (1996) Adv. Compos. Mater., 5: 139.
2. Young, G.L. and Xu, H. (2001) Etching Carbon Fiber Laminates as a Precursor to Electroless Plating, Int. SAMPE Symposium and Exhibition (Proceedings), 46, 1438.
3. Kikuchi, F., Eguchi, S., Suzuki, J., Sekine, K., and Takamura, T. (2003) Electrochemistry, 71: 1117.
4. Yang, M. and Scott, V.D. (1991) Carbon, 29: 877.
5. Balaba, W.M., Weirauch, D.A., Perrotta, A.J., Armstrong, G.H., Princewill, N., Anyalebechi, Kauffman, S., Maclnnes, A.N., Winner, A.M., and Barron, A.R. (1993) J. Mater. Res., 8: 3192.
6. Korab, J., Korb, G., Stefanik, P., and Degischer, H.P. (1999) Compos.-Part A: Appl. Sci. Manuf., 30: 1023.
7. Tanahashi, I., Yoshida, A., and Nishino, A. (1990) Carbon, 28: 477.
8. Nishino, A. (1996) J. Power Sources, 60: 137.
9. Akbulut, H. and Inal, O.T. (1998) J. Mater. Sci, 33: 1189.
10. Hag, E., Costa, S.F., and Pessa, L.A. (1997) J. Adhes. Sci. Technol., 11: 1491.
11. Suchentrunk, R. (1993) Metallizing of Plastics-A Handbook of Theory and Practice; Finishing Publications Ltd: Stevenage, 1.
12. He, F. and Wang, M.Z. (1995) In Carbon Fibers and Their Applications; Scientific Press: Beijing, 150.
13. Satas, D. (1986) In Plastics Finishing and Decoration; Van Nostrand Reinhold Company: New York, 99.
14. Chan, H.Y.H., Takoudis, C.G., and Weaver, M.J. (1999) Electrochem. Solid. State. Lett., 2: 189.
15. Fukunaga, A., Komami, T., Ueda, S., and Nagumo, M. (1999) Carbon, 37: 1087.
16. Ryu, S.-K.; Seoul, K.R.; Su, K.; et al. Plating Method of Metal Film on the Surface of Polymer. US Patent, 4956197.
17. Eufinger, S., Ooij, W.J., and Van, Ridgway, T.H. (1996) J. Appl. Polym. Sci. 61: 1503.
18. Zhuang, H. and Wightman, J.P. (1997) J. Adhesion., 62: 213.
19. Feih, S. and Schwartz, P. (1998) J. Adhes. Sci. Technol., 12: 523.
20. Li, R.Z., Ye, L., and Mai, Y.W. (1997) Compos.-Part A.: Appl. Sci. Manuf., 28: 73.
21. Waldman, D.A., Zou, Y.L., and Netravali, A.N. (1995) J. Adhes. Sci. Technol., 9: 1475.
22. Meyer, M., Mittasch, A., Staudigl, G., and Suchentrunk, R. (1993) Surf. Coat. Tech., 59: 297.
23. Fessmann, J., Mann, D., Kampschulte, G., Leyendecker, F., Bolch, T., Mertz, K., Jonke, D., Gammel, F.J., Meyer, M., and Suchentrunk, R. (1992) Surf. Coat Tech., 55: 599.
24. Muller, G. and Baudand, D.W. (1971) Plating on Plastics. 2nd Ed.; Robert Draper Ltd: Teddington, 88.
25. Zhang, J., Wu, M.Z., Pu, T.S., Zhang, Z.Y., Jin, R.P., Tong, Z.S., Zhu, D.Z., Cao, D.X., Zhu, F.Y., and Cao, J.Q. (1997) Thin Solid Films, 307: 14.
26. Minamihashi, K., Masaki, H., Iwasaki, M., and Ito, S. (1997) Prog. Org. Coat., 31: 121.
27. Dilsiz, N. and Wightman, J.P. (1999) Carbon, 37: 1105.
28. Ishitani, A. (1981) Carbon, 19: 269.
29. Takahagi, T. and Ishitani, A. (1984) Carbon, 22: 43.
30. Sherwood, Peter, M.A. (1996) J. Electron Spectrosc., 81: 319.
31. Barr, T.L. (1994) In Mordern ESCA-. In The Principles and Practice of X-ray Photoelectron Spectroscopy; CRS Press: London, 214.
32. Kinloch, A.J. (1987) Adhesion and Adhesives; Chapman and Hall Ltd: London and New York, 115.
33. Liston, E.M., Martinu, L., and Wertheimer, M.R. (1993) J. Adhes. Sci. Technol., 7: 109.