The influence of annealing temperature on the microstructural development of W-Cu composite powder prepared by high-energy ball milling

Journal of Alloys and Compounds

Volumn 424, Issue 1-2, 2006, Pages 209-212

  Ryu, Sung Soo ^a   Kim, Gil Su ^b   Kim, Jin Chun ^c   Oh, Sung Tag ^d   Kim, Young Do ^b  

^a Korea Institute of Ceramic Engineering and Technology (KICET)   (South Korea)

^b Hanyang University   (South Korea)

^c University of Ulsan   (South Korea)

^d Seoul National University of Science and Technology   (South Korea)

Author keywords

Annealing temperature; Microstructure; Nanocrystalline W Cu powders

Indexed keywords

ANNEALING; BALL MILLING; GRAIN GROWTH; MICROSTRUCTURE; NANOSTRUCTURED MATERIALS; TUNGSTEN ALLOYS;

ANNEALING TEMPERATURE; NANOCRYSTALLINE W-CU POWDERS; POWDER DENSITY; POWDER MIXTURES;

COMPOSITE MATERIALS;

EID: 33748979518     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2005.10.082     Document Type: Article

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