Laser programmable vias for reconfiguration of integrated circuits

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 1138, Issue , 1989, Pages 190-197

  Rouillon Martin, Martine ^a   Chambon, Maguelonne ^a   Boudou, Alain ^a  

^a Bull SA ^*  (France)

Author keywords

[No Author keywords available]

Indexed keywords

REFRACTORY METALS; TIMING CIRCUITS; VLSI CIRCUITS; YTTRIUM ALUMINUM GARNET;

BREAKDOWN CURRENTS; DOUBLED FREQUENCIES; ELECTRICAL MEASUREMENT; INSULATING LAYERS; METAL INTERCONNECTIONS; METALLIC LINES; RELIABILITY TEST; VIA RESISTANCE;

RECONFIGURABLE HARDWARE;

EID: 33748859933     PISSN: 0277786X     EISSN: 1996756X     Source Type: Conference Proceeding    
DOI: 10.1117/12.961763     Document Type: Conference Paper

References (8)

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3. L. Kuhn, S.E. Schuster, P.S. Zory, G.W. Lynch, J.T. Parrish. “Experimental study of laser formed connections for L.S.I, wafer personne lization”. IEEE JSSC. 10, 4 (1975)
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