SCOPUS 정보 검색 플랫폼

Journal of Adhesion Science and Technology

Volumn 20, Issue 10, 2006, Pages 1079-1089

A methodology for detecting interfacial debonding in clay/epoxy nanocomposites

(3) Kim, Jae Hyun a Holmes, Gale A a Snyder, Chad R a

a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY (United States)

Author keywords

Debonding; Failure analysis; Montmorillonite; Nanocomposite

Indexed keywords

CLAY MINERALS; COMPUTER SOFTWARE; DEBONDING; ELECTRIC LIGHTING; EPOXY RESINS; FAILURE ANALYSIS; IMAGE ANALYSIS; INTERFACES (MATERIALS); NANOCOMPOSITES;

INTERFACIAL DEBONDING; MONTMORILLONITE; TENSILE DEFORMATION;

NANOSTRUCTURED MATERIALS; DEBONDING;

FAILURE STRAIN; GAUGE LENGTH; IMAGE ANALYSIS SOFTWARE; INTERFACE DEBONDING; INTERFACIAL DEBONDING; MATRIX; NOVEL METHODOLOGY; TENSILE DEFORMATION; TEST SPECIMENS; TRANSMITTED LIGHT; WEAK INTERFACE;

EID: 33748714208 PISSN: 01694243 EISSN: None Source Type: Journal
DOI: 10.1163/156856106777890644 Document Type: Article

Times cited : (2)

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