Noise and cooling in electronics packages

IEEE Transactions on Components and Packaging Technologies

Volumn 29, Issue 3, 2006, Pages 535-542

  Lyon, Richard H ^a   Bergles, Arthur E ^b,c  

^a RH Lyon Corporation   (United States)

^b Rensselaer Polytechnic Institute ^*

^c RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

Circuit board cooling; Cooling and noise; Electronic packages; Fan and flow noise

Indexed keywords

COOLING; FANS; HEAT TRANSFER; PRINTED CIRCUIT BOARDS; SPURIOUS SIGNAL NOISE; TURBULENT FLOW;

CIRCUIT BOARD COOLING; TURBULENT AIRFLOW;

ELECTRONICS PACKAGING;

EID: 33748573653     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2006.880512     Document Type: Article

References (12)

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