Integration of MIM capacitors with low-k/Cu process for 90 nm analog circuit applications

Proceedings of the IEEE 2003 International Interconnect Technology Conference, IITC 2003

Volumn , Issue , 2003, Pages 183-185

  Ahm, Jeong Hoon ^a   Lee, Kyung Tae ^a   Jung, Mu Kyeung ^a   Lee, Yong Jun ^a   Oh, Byung Jun ^a   Liu, Seong Ho ^a   Kim, Yoon Hae ^a   Kim, Young Wug ^a   Suh, Kwang Pyuk ^a  

^a SAMSUNG Electronics   (South Korea)

Author keywords

Analog circuits; Dielectrics; Electrodes; Electronic equipment testing; Etching; Integrated circuit interconnections; MIM capacitors; Parasitic capacitance; Silicon compounds; Vehicles

Indexed keywords

ANALOG CIRCUITS; AUTOMOBILE ELECTRONIC EQUIPMENT; CAPACITANCE; CAPACITORS; DIELECTRIC MATERIALS; ELECTRODES; ELECTROLYTIC CAPACITORS; ELECTRONIC EQUIPMENT; ELECTRONIC EQUIPMENT TESTING; EQUIPMENT TESTING; ETCHING; INTEGRATED CIRCUIT INTERCONNECTS; INTEGRATED CIRCUIT TESTING; INTEGRATION TESTING; MIXED SIGNAL INTEGRATED CIRCUITS; OSCILLATORS (ELECTRONIC); SILICON COMPOUNDS; VEHICLES;

CIRCUIT APPLICATION; CONVENTIONAL CAPACITORS; DUAL DAMASCENE PROCESS; INTEGRATED CIRCUIT INTERCONNECTIONS; MIM CAPACITORS; MIXED SIGNAL APPLICATIONS; PARASITIC CAPACITANCE; PARASITIC COMPONENTS;

MIM DEVICES;

EID: 33748569221     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2003.1219749     Document Type: Conference Paper

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